ESP42
FEATURES
- Molded 0.3" integrated circuit packing outline allowing automatic insertion
- Smaller size makes better heat convection during PC board reflow wave soldering
- Top tape sealed to withstand reflow wave soldering, board washing
- Housing materials are UL 94V-0 grade fire retardant plastics
- Gold plated contact to ensure low contact resistance and tin plated terminal to prevent contamination daring soldering
- RoHS Compliant
