ESL

Features

End stackable for standard 0.1" integrated circuit pitch.
Molded 0.3" integrated circuit packing outline allowing automatic insertion.
Smaller size makes better heat convection during PC board reflow wave soldering.
Top tape sealed to withstand wave soldering, board washing.
All plastics are UL 94V-0 grade fire retardant.
Twin contacts designed to ensure stable contact.
Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent contamination during soldering.
RoHS Compliant